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Characteristic:
1.Patented design, intelligent adjustment of input package outline dimension.
2.Wide range of application, applicable to all floor specifications in the current market.
3.It can be divided into point coatinq, seament coating and line coating according to the packaging requirements.
4.Modular design, reserved laser marking machine, labeling machine and other equipment modules.
5.Highly digital integration and docking with MES system.
Applicable Fields:
Packaging of all four-sided hot melt adhesive products, such as SPC floor, LVT floor, WPC foor, wood floor, furniture.doors and windows and other plate packaging.
Technical parameters:
Model | BBS2L34 | BBS334 |
Processing length(mm) | 600-1250 | 600-1850 |
Processing width(mm) | 100-300 | 100-300 |
Processing thickness(mm) | 30-80 | 30-80 |
Voltage | 380V/50HZ | 380V/50HZ |
Power(KW) | 21.5 | 21.5 |
Efficiency (min/pack) | 8-12 | 8-12 |